agiNext™ Technology Stack
agiNext™ stands as the unified innovation and engineering identity for our specialized technologies, proprietary know-how, and engineer-to-manufacture process, built on a 10-year continuum in the fields of motion, sensing, and force control for advanced industry.
Our Technologies
Based on agiNext™ magnetics, motion, sensing, and measurement technologies, we manufacture standard and configurable products, engineering problem-tailored solutions to revolve complex technical challenges within advanced automation and robotics.
- Advanced Magnetics Technology: Utilizing FEM modeling and Halbach array configurations, we engineer proprietary magnetic circuits and topologies, which deliver contactless and frictionless capabilities, precisely controlled magnetic forces, ultra-low hysteresis actuation, and strong immunity to severe environments.
- High-Dynamic Motion Technology: By optimizing magnetic flux utilization, coil winding configuration, and thermal management system, we maximize the system-level synergy of direct-drive stator and forcer, which achieves high-dynamic acceleration, ultra-precision alignment, and an exceptional balance of force density and smoothness.
- High-Resolution Sensing Technology: By optimizing the MR-ratio and spatial layout of magnetoresistive array, along with high-bandwidth PDA response and heat-isolation mechanism, we deliver high-fidelity signal acquisition and processing for both magnetic tracks and optical Moiré fringes, which guarantees high-precision, high-velocity, and high-robustness closed-loop position feedback.
- Ultra-Precise Measurement Technology: By optimizing low-expansion substrate materials, high-precision grating fabrication, and robust scale protection, we establish unyielding physical coordinate baseline, which delivers metrology-grade measurement accuracy and repeatability.
Our Know-how
Based on the deep fusion of our technologies and application experience, we have deposited many unwritten, highly practical engineering secrets for solving most mission-critical precision, reliability, and high-throughput challenges.
Our decade of on-the-ground technical know-how involves proprietary magnetic circuit engineering system, grating-scale test and calibration process, custom bonding formulations used for advanced assembly, and so on.

